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Low-temperature high-performance thermoelectric material and preparation method thereof
Low-temperature high-performance thermoelectric material and preparation method thereof
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机译:低温高性能热电材料及其制备方法
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摘要
A low-temperature high-performance thermoelectric material possesses a chemical formula of (AgyCu2−y)1−xTe1−zSez, wherein −0.025≤x≤0.075, 0.6≤y≤1.4, 0z≤0.25, diffraction peaks of a main phase of the thermoelectric material are indexed as a cubic structure at room temperature of 300 K, a highest ZT value between 300 K and 673 K is in range of 0.4 to 1.6, an average ZT value (ZT)avg is in range of 0.2 to 1.4. The highest ZT value of this material at the room temperature is comparable to that of Bi2Te3, which is an excellent complement to existing low-temperature thermoelectric materials. At the same time, the present invention also indicates a new strategy to improve the low-temperature thermoelectric performance of Cu2X-based (here, X is S, Se, Te) materials, and lays a foundation for the application of Cu2X-based materials in the field of low-temperature thermoelectricity.
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机译:低温高性能热电材料的化学分子式为(Ag y Sub> Cu 2-y Sub>) 1-x Sub> Te 1-z Sub> Se z Sub>,其中-0.025≤x≤0.075、0.6≤y≤1.4、0 avg Sub>介于0.2至1.4之间。该材料在室温下的最高ZT值可与Bi 2 Sub> Te 3 Sub>相比,这是对现有低温热电材料的绝佳补充。同时,本发明还提出了一种改善Cu 2 Sub> X基(此处X为S,Se,Te)材料的低温热电性能的新策略, Cu 2 Sub> X基材料在低温热电领域的应用基础。
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