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Component Carrier With Bridge Structure In Through Hole Fulfilling Minimum Distance Design Rule

机译:通孔实现最小距离设计规则的桥梁结构构件载体

摘要

A component carrier with an electrically insulating layer structure has opposed main surfaces, a through-hole, and an electrically conductive bridge structure connecting opposing sidewalls delimiting the through-hole. The sidewalls have a first tapering portion extending from a first main surface and a second tapering portion extending from a second main surface. A first demarcation surface faces the first main surface and a second demarcation surface faces the second main surface. A central bridge plane extends parallel to the first main surface and the second main surface and is at a vertical center between a lowermost point of the first demarcation surface and an uppermost point of the second demarcation surface. A first intersection point is between the central bridge plane and one of the sidewalls delimiting the through hole. A length of a shortest distance from the first intersection point to the first demarcation surface is at least 8 μm.
机译:具有电绝缘层结构的部件载体具有相对的主表面,通孔和连接限定通孔的相对侧壁的导电桥结构。侧壁具有从第一主表面延伸的第一锥形部分和从第二主表面延伸的第二锥形部分。第一分界表面面对第一主表面,第二分界表面面对第二主表面。中心桥平面平行于第一主表面和第二主表面延伸,并且在第一分界表面的最低点和第二分界表面的最高点之间的垂直中心处。第一相交点在中心桥平面和限定通孔的侧壁之一之间。从第一交点到第一分界面的最短距离的长度为至少8μm。

著录项

  • 公开/公告号US2020253050A1

    专利类型

  • 公开/公告日2020-08-06

    原文格式PDF

  • 申请/专利权人 AT&S (CHINA) CO. LTD.;

    申请/专利号US202016751024

  • 发明设计人 MIKAEL TUOMINEN;

    申请日2020-01-23

  • 分类号H05K1/11;H05K1/02;H05K1/09;H05K3/40;

  • 国家 US

  • 入库时间 2022-08-21 11:19:41

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