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Integration of Porous Monolithic Structures Within Microfluidic Systems

机译:微流体系统中多孔整体结构的集成

摘要

In an embodiment, a microfluidic chip includes a capillary is disposed between upper and lower substrates, where the capillary includes a porous monolithic structure disposed within the capillary, and a clamp structure is defined within the channel and engages with the capillary. The clamp structure comprises a thermoplastic material that, when heated to a selected temperature, deforms around the capillary to secure the capillary in alignment with the channel. In another embodiment, a microfluidic chip includes a porous monolithic brick disposed between first and second substrates, where each of the first and second substrates includes a channel extending through the substrate to the brick structure to provide a fluid flow path through the each of the first substrate, the second substrate and the brick structure.
机译:在一个实施例中,微流体芯片包括设置在上基板和下基板之间的毛细管,其中该毛细管包括设置在该毛细管内的多孔单片结构,并且在该通道内限定夹具结构并与该毛细管接合。夹具结构包括热塑性材料,当加热到选定温度时,该热塑性材料围绕毛细管变形以将毛细管固定成与通道对准。在另一个实施例中,微流体芯片包括设置在第一和第二基板之间的多孔单块砖,其中,第一和第二基板中的每个包括延伸穿过基板到砖结构的通道,以提供穿过每个第一基板的流体流动路径。基板,第二基板和砖结构。

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