首页> 外国专利> ELECTRONIC MODULE FOR ARRANGEMENT TO A TRANSMISSION COMPONENT AND A METHOD FOR ARRANGING AN ELECTRONIC MODULE TO A TRANSMISSION COMPONENT

ELECTRONIC MODULE FOR ARRANGEMENT TO A TRANSMISSION COMPONENT AND A METHOD FOR ARRANGING AN ELECTRONIC MODULE TO A TRANSMISSION COMPONENT

机译：用于布置传输组件的电子模块和用于布置传输组件的电子模块的方法

页面导航

摘要
著录项
相似文献

摘要

The invention relates to an electronic module (100) mounted on a transmission component (112). The electronic module (100) comprises a printed circuit board element (102) that has component side (104) with at least one electronic component (108) and a contact side (106) lying opposite the component side (104), and a heat conducting film (110) that is placed between a surface section of the contact side (106) lying opposite the component (108) and a surface section of the transmission component (112). The printed circuit board element (102) can be or is tightened to the transmission component (112) such that the heat conducting film (110) is pressed against the surface section of the contact side (106) and the surface section of the transmission component (112).

机译：本发明涉及一种安装在传动部件（ 112 ）上的电子模块（ 100 ）。电子模块（ 100 ）包括印刷电路板元件（ 102 ），其元件侧（ 104 ）带有至少一个电子元件（ 104 ） 108 ）和与组件侧（ 104 ）相对的接触侧（ 106 ）和导热膜（ 110 < / B>）放置在与组件（ 108 ）相对的接触侧（ 106 ）的表面部分和传输组件（ 112 ）。可以将印刷电路板元件（ 102 ）或紧固到传输组件（ 112 ）上，以使导热膜（ 110 ）将其压在接触侧的表面部分（ 106 ）和透射组件的表面部分（ 112 ）上。 展开▼

著录项

公开/公告号US2019364656A1

专利类型

公开/公告日2019-11-28

原文格式PDF

申请/专利权人 ZF FRIEDRICHSHAFEN AG;
展开▼

申请/专利号US201916413982

发明设计人 HERMANN JOSEF ROBIN;MARTIN HEMPEN;THOMAS MAIER;
展开▼

申请日2019-05-16

分类号H05K1/02;H05K1/18;H05K3/30;

国家 US

入库时间 2022-08-21 11:19:06

相似文献

专利

外文文献

中文文献

1. 用于布置在变速器部件上的电子模块及其布置方法 [P] . 中国专利： CN110519963A . 2019-11-29

2. 用于制造电子模块组件的方法和电子模块组件 [P] . 中国专利： CN108242401B . 2021.10.01

3. Electronic module for arrangement to a transmission component and a method for arranging an electronic module to a transmission component [P] . 美国专利： US10652995B2 . 2020-05-12

机译：用于布置在变速器部件上的电子模块以及用于将电子模块布置在变速器部件上的方法

4. Electronic module for mounting on a transmission component and method for arranging an electronic module on a transmission component [P] . 德国专利： DE102018207943A1 . 2019-11-28

机译：用于安装在变速器部件上的电子模块以及用于在变速器部件上布置电子模块的方法

5. OPTICAL TRANSMISSION MODULE PROVIDED WITH REINFORCING COMPONENT FOR REINFORCING SUBSTRATE OF OPTICAL TRANSMISSION MODULE, AND ELECTRONIC DEVICE PROVIDED WITH THE OPTICAL TRANSMISSION MODULE [P] . 韩国专利： KR101148416B1 . 2012-05-25

机译：提供有用于增强光学传输模块的基质的增强成分的光学传输模块以及具有该光学传输模块的电子设备

1. New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids [J] . Andreas Griesinger, Christian Windel, Yungwan Kwak, 电子器件冷却与温度控制期刊（英文） . 2021,第001期

2. Design of Wireless Transmission System for Shallow Seismograph Based on 433 M Module [J] . Li Liu, Chengguang Zhang, Taiquan Li, 长江油气(英文版) . 2019,第002期

3. Design of the high voltage isolation transmission module with low delay for ECRH system on J-TEXT [J] . Haiyan MA, Donghui XIA, Zhijiang WANG, 等离子体科学和技术（英文版） . 2018,第002期

4. The new standard components! Using Cheap Asian Electronic Modules Part 1 [J] . JIM ROWE Everyday practical electronics . 2018,第1期

5. Electronic Components, Modules Give Glimpse of Advanced Cars [J] . Asia electronics industry . 2016,第3期

6. El cheapo electronic modules - the new standard components [J] . Leo Simpson Silicon Chip . 2016,第10期

7. Toward a reliability analysis method of wide band gap power electronic components and modules [C] . Parent Guillaume, Massiot Gregor, Rouet Vincent, European Microelectronics Packaging Conference . 2013

8. Thermal and thermomechanical behavior of multi-material molded modules with embedded electronic components for biologically-inspired and multi-functional structures. [D] . Gyger, Lawrence S., Jr. 2006

9. Methods of Measuring Compliance with Transmission-Based Isolation Precautions: Comparison of Paper-Based and Electronic Data Collection [O] . -1

10. Towards a reliability analysis method of wide band gap power electronic components and modules [O] . Parent Guillaume, Massiot Gregor, Rouet Vincent, 2013

11. Manufacturing Methods and Technology Study Covering Methods for Manufacturing Electronic Modules. Printed Wiring Module Producibility Guidelines and Specification for Automatic Component Assembly. [R] . rang,robert c. 1973

1. A Method of Clustering Components into Modules Based on Products' Functional and Structural Analysis [J] . 孟祥慧 ,蒋祖华 ,郑迎飞 . 上海交通大学学报：英文版 . 2006,第3期

2. Increase Ultrasonics Cleaning Efficiency of Electronics Modules [J] . Vladimir L. Lanin ,Vladimir S. Tomal . 工程（英文）（1947-3931） . 2013,第2期

3. 用于联接离合器毂与带轴齿轮的组件及方法研究 [C] . Keqing ZHANG ,张克青 ,Huarong DUAN . 2014年全国机电企业工艺年会暨第八届机械工业节能减排工艺技术研讨会 . 2014

4. 卫星舱组件分配与布置的集成布局方法 [A] . 郝亮 . 2016