pressure-sensitive hot-melt adhesive composition with enhanced rheological properties

摘要

the invention is directed to adhesive compositions containing at least a first styrene-isoprene-styrene block copolymer with a diblock content of not less than 45%, at least a second styrene-isoprene-styrene block copolymer with a styrene content not more than 30% by weight, at least one first taching resin with a softening point equal to or greater than 100 ° c and at least one second taching resin with a softening point equal to or greater than 120 ° c. the invention is also directed to a method for bonding substrates using the adhesive composition.