Hot-melt pressure sensitive adhesive composition having improved rheological properties

摘要

An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100° C., and at least one second tackifying resin having a softening point of equal to or higher than 120° C. Further, a method for bonding substrates together using the adhesive composition.