首页> 外国专利> GLUED ASSEMBLY, ASSEMBLY PROCESS OF A RIGID ELEMENT ON A SUBSTRATE AND STRENGTHENING PROCESS OF A STRUCTURE BEING AT LEAST ONE SUBSTRATE

GLUED ASSEMBLY, ASSEMBLY PROCESS OF A RIGID ELEMENT ON A SUBSTRATE AND STRENGTHENING PROCESS OF A STRUCTURE BEING AT LEAST ONE SUBSTRATE

机译:基板上的固结装配,刚体装配过程以及至少一个基板上的结构加固过程

摘要

glued assembly and assembly and reinforcement processes involving the application thereof, the invention relates to a glued assembly adapted particularly to assemble a new element on a structure or to reinforce a structure. the glued assembly comprises a substrate (1), a rigid element (2) arranged with a gap in relation to the substrate, at least one gasket (3) compressed between the substrate and the rigid element and delimiting a watertight volume in said gap, and a hardened adhesive (13) occupying said volume. the joint is compressed by the rigid element retained on the substrate by the hardened adhesive.
机译:胶合组件以及涉及其应用的胶合组件和增强方法,本发明涉及一种胶合组件,其特别适于在结构上组装新元件或增强结构。胶合组件包括:基底(1);相对于基底布置有间隙的刚性元件(2);压缩在基底和刚性元件之间并在所述间隙中界定水密体积的至少一个垫圈(3),硬化的粘合剂(13)占据所述体积。接头被硬化的粘合剂保留在基板上的刚性元件压缩。

著录项

  • 公开/公告号BRPI1016043B1

    专利类型

  • 公开/公告日2020-09-24

    原文格式PDF

  • 申请/专利权人 COLD PAD;

    申请/专利号BR2010PI16043

  • 发明设计人 JEAN-PHILIPPE COURT;RENÉ-LOUIS GEFFROY;

    申请日2010-06-18

  • 分类号F16L13/10;F16B11;

  • 国家 BR

  • 入库时间 2022-08-21 11:18:06

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