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POLYCRYSTALLINE DIAMOND SINTERED/REBONDED ON CARBIDE SUBSTRATE CONTAINING LOW TUNGSTEN

机译:在低钨硬质合金上烧结/粘合的多晶金刚石

摘要

A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.
机译:形成多晶金刚石切割元件的方法包括组装金刚石材料,基底以及与基底不同的催化剂材料或渗透材料的源,催化剂材料或渗透材料的源与金刚石材料相邻以形成组件。基板包括包含难熔金属的附接材料。使组件经受第一高压/高温条件以使催化剂材料或浸润剂材料熔化并渗入金刚石材料中,并经受第二高压/高温条件以使附接材料熔融并浸入其中。渗入一部分渗入的金刚石材料以将渗入的金刚石材料粘结到基底上。

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