Bonding Machines For Bonding Semiconductor Elements, Methods Of Operating Bonding Machines, And Techniques For Improving UPH On Such Bonding Machines

摘要

A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.