首页> 外国专利> INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK PROPAGATION IN MATERIAL CLEAVAGE

INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK PROPAGATION IN MATERIAL CLEAVAGE

机译:裂纹在材料裂解中的受控辐照传播引起的入射辐射引起的表面损伤

摘要

A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed.
机译:切割系统采用整形器,定位器,内部准备系统,外部准备系统,切割器和裁切器将工件切割成切割件。整形器将工件整形为定义的几何形状。然后定位器对工件进行定位,以使内部准备系统可以在劈开平面处产生分离层。内部准备系统将激光束聚焦在工件内部,并在切割面上扫描该聚焦点以形成分离层。外部准备系统在与分离层一致的位置刻划工件的外表面。切割刀通过沿着分离层在外表面上传播裂纹来切割工件。裁切机根据需要将劈开的部分成形为几何形状。

著录项

  • 公开/公告号WO2020023929A1

    专利类型

  • 公开/公告日2020-01-30

    原文格式PDF

  • 申请/专利权人 HALO INDUSTRIES INC.;

    申请/专利号WO2019US43774

  • 发明设计人 IANCU ANDREI TEODOR;RUDY CHARLES WILLIAM;

    申请日2019-07-26

  • 分类号B23K26/53;H01S5/02;

  • 国家 WO

  • 入库时间 2022-08-21 11:13:39

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