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INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK PROPAGATION IN MATERIAL CLEAVAGE
INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK PROPAGATION IN MATERIAL CLEAVAGE
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机译:裂纹在材料裂解中的受控辐照传播引起的入射辐射引起的表面损伤
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摘要
A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed.
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