FIRST STAGE CERAMIC ASSEMBLED SUBSTRATE, SECOND STAGE CERAMIC ASSEMBLED SUBSTRATE, METHOD OF MANUFACTURING SECOND STAGE CERAMIC ASSEMBLED SUBSTRATE, AND METHOD OF MANUFACTURING STACKED ELECTRONIC COMPONENT

摘要

The purpose of the present invention is to fabricate a stacked electronic component in which internal electrodes are arranged appropriately even if a stacking error has occurred in the internal electrodes at the stage of a ceramic assembled substrate. A first-stage ceramic assembled substrate comprising a plurality of first-stage first internal electrodes 12 arranged side by side in the X-direction with a first gap 13 therebetween having a width a, and a plurality of first-stage second internal electrodes 15 arranged side by side in the X-direction with a second gap 16 therebetween having a width b is fabricated and used. The first-stage first internal electrodes 12 have, in at least one end thereof in the Y-direction, a first cutout 14 extending in the X-direction and the Y-direction and having the width b in the X-direction. The first-stage second internal electrodes 15 have, in at least one end thereof in the Y-direction, a second cutout 17 extending in the X-direction and the Y-direction and having the width a in the X-direction. The first-stage ceramic assembled substrate, when seen through in the Z-direction, includes a first region 18 in which the first gap 13 and the second cutout 17 overlap each other, and a second region 19 in which the second gap 16 and the first cutout 14 overlap each other.