PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE, AND FORMATION METHOD FOR PACKAGE STRUCTURE

摘要

A package structure that comprises a metal member and a resin member. The metal member has a principal surface that faces one way in a first direction. The resin member is arranged to contact at least a portion of the principal surface. The principal surface includes a roughened area. A plurality of first linear grooves that are each recessed from the principal surface and that each have a greater surface roughness than the principal surface are formed in the roughened area. The plurality of first linear grooves each extend in a second direction that is orthogonal to the first direction and are aligned in a third direction that is orthogonal to the first direction and the second direction. The resin member fills each of the plurality of first linear grooves.