METHOD AND SYSTEM FOR INTEGRITY TESTING OF BLISTER PACKAGES

摘要

A method and system for integrity testing of a blister package. The method comprises the steps of providing an electrode structure comprising at least one pair of electrodes; disposing a blister of the blister package relative to the electrode structure such that the blister is subjectable to an electric field resulting from the application of an AC bias voltage to the electrode structure; applying the AC bias voltage to the electrode structure; measuring an electrical property of the blister over a frequency range while the AC bias voltage is varied over the frequency range; and determining the integrity of the blister package based on the measured electrical property of the blister over the frequency range.