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METHODS OF ALIGNMENT MARKING SEMICONDUCTOR WAFERS, AND SEMICONDUCTOR PACKAGES HAVING PORTIONS OF ALIGNMENT MARKINGS
METHODS OF ALIGNMENT MARKING SEMICONDUCTOR WAFERS, AND SEMICONDUCTOR PACKAGES HAVING PORTIONS OF ALIGNMENT MARKINGS
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机译:对准标记的方法半导体晶片,以及具有对准标记的部分的半导体封装
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摘要
Some embodiments include a semiconductor package. The semiconductor package has a semiconductor die with a primary region which includes integrated circuitry, and with an edge region which includes a portion of an alignment mark location. The portion of the alignment mark location includes a segment of an alignment mark. The alignment mark includes a pattern of lines and spaces, with the lines extending along a first direction. The portion of the alignment mark location also includes a texture having a pattern other than lines extending along either the first direction or along a second direction substantially orthogonal to the first direction. Some embodiments include methods for alignment marking semiconductor wafers.
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