Heat shrink component with heat spreading layer, and method of assembling a heat shrink component

摘要

Heat shrink component with heat spreading layer, and method of assembling a heat shrink component The present invention relates to a heat shrink component and method of assembling a heat shrink component. The heat shrink component has first dimensions (102A, 104A) in an expanded state and second dimensions (102B, 104B) in a shrunk state, at least one of the first dimensions (102A) being larger than the corresponding second dimension (102B) and said heat shrink component (100, 100A, 0B) comprises a heat shrink layer (108), and at least one heating unit (120) that is arranged in thermal contact to at least a part of said heat shrink layer (108), said heating unit (120) being operable to heat 10 up the heat shrink layer (108) to its heat shrink temperature. The heating unit (120) comprises at least one electrically conductive lead (106, 116), and at least one heat spreading layer (124) arranged in thermal contact to the at least one electrically conductive lead (106) for distributing the heat generated by the electrically conductive lead (106). FIG. 18