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INLAY SUBSTRATE AND LIGHT EMISSION DEVICE IN WHICH SAME IS USED

机译:使用相同的嵌体基板和发光装置

摘要

A light emission device, provided with a plurality of light-emitting elements, a first substrate on which the plurality of light-emitting elements are mounted, a second substrate having a smaller thermal conductivity than the first substrate, first wiring disposed in the uppermost wiring layer of the first substrate, second wiring disposed in another wiring layer of the first substrate, and first wiring disposed in the uppermost wiring layer of the second substrate. Parts of the first wiring to which a light-emitting element is connected are electrically connected to the second wiring through through holes disposed in an array region on which the plurality of light-emitting elements are mounted. The second wiring is electrically connected to other first wiring through through holes disposed outside of the array region. The other first wiring and third wiring are electrically connected by fourth wiring.
机译:一种发光装置,其具有多个发光元件,其上安装有多个发光元件的第一基板,导热率比第一基板小的导热性的第二基板,配置在最上层的配线中的第一配线第一基板的第一配线层,第二配线设置在第一基板的另一配线层中,第一配线设置在第二基板的最上配线层中。第一配线的与发光元件连接的部分通过设置在安装有多个发光元件的阵列区域中的通孔与第二配线电连接。第二布线通过设置在阵列区域外部的通孔与其他第一布线电连接。另一个第一配线和第三配线通过第四配线电连接。

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