DEVICE FOR THERMAL PROCESSING OF AN ELECTRICAL ELEMENT LIABLE TO GET HOT AND METHOD IMPLEMENTING THE THERMAL PROCESSING DEVICE

摘要

The invention relates to a device (200) for thermal processing of at least one electrical element placed in a chamber (120) and liable to get hot, the thermal processing device (200) comprising at least one first circuit configured to be passed through by a heat-transfer fluid and at least one second circuit configured to be passed through by a dielectric fluid, characterised in that the first circuit and the second circuit are at least partially bounded by a face placed facing the chamber (120). The invention also relates to an electrical device (100) comprising a casing (110), a plurality of electrical elements liable to get hot and a thermal processing device (200). The invention relates to a method for cooling a plurality of electrical elements liable to get hot of an electrical device (100).