ENCAPSULATION MODULE BASED ON PINS OF PCB BODY AND PREPARATION METHOD THEREFOR

摘要

The present application relates to the technical field of power supply encapsulation, and specifically relates to an encapsulation module based on pins of a PCB body, comprising an encapsulation module and pins protruding from the encapsulation module. The encapsulation module comprises a PCB body and a power component, a first surface and a second surface being provided opposite each other on the PCB body, and the power component being provided on the first surface or the second surface. A signal from the power component, by means of surface layer copper on the PCB body, is in communicative connection with a pin on one side of the first surface or of the second surface. The pin positioned on one side of the first surface or of second surface of the PCB body is an etched pattern in the surface layer copper positioned on the PCB body and protruding out of the encapsulation module. The encapsulation module has a small volume, and does not require complicated pin welding processing after encapsulation.