A hexaarylbiimidazole hybrid photoinitiator, having a structure as represented by formula (I), and containing a biimidazole compound having four attachment sites, i.e., 1'-2, 2-3', 1-2' and 2'-3. The total mass percentage content of the biimidazole compound having the four attachment positions in the hybrid photoinitiator is above 92%. Ar 1, Ar 2, Ar 3, Ar 4, Ar 5, and Ar 6 in the formula (I) each independently represents a substituted or unsubstituted aryl group. A photosensitive resin composition containing the hexaarylbiimidazole hybrid photoinitiator has good compatibility, excellent photosensitivity, and a small amount of developing waste, and can be widely used in the forms of a dry film and a wet film.
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