LOW-COST PROCESS FOR PRODUCING A MODULAR POWER SWITCHING ELEMENT

摘要

The process of the invention is designed to produce a modular power switching element (MP) comprising first and second laminated blocks (BL, BH) between which at least one transistor chip (CP-i, CP2) is held. The first and second laminated blocks comprise, respectively, first and second busbars (BBL, BBH) on which dielectric and conductive internal layers are laminated. The process comprises, prior to laminating the first and second laminated blocks, the parallel production of a first blank of the first laminated block (BL) and of a second blank of the second laminated block (BH), this parallel production comprising at least one operation of punching and/or stamping using a punch forming at least one opening (OR1, OR2) in the first busbar and/or the second busbar, forming a dielectric layer (DL1, DL2) covering the inside of the opening and metallizing (CU2, CU3) the inside of the opening including the dielectric layer.