PRINTED CIRCUIT BOARDS WITH SOLDER JOINTS OF HIGHER MELTING TEMPERATURES AND TRACES COUPLING ELECTRICAL CONTACTS AT DIFFERING POSITIONS

摘要

A chip may be secured to a first printed circuit board (PCB) at a first electrical contact with a first solder joint. The first PCB may be secured to a second PCB with a second solder joint at a second electrical contact. A melting temperature of the first solder joint may be higher than a melting temperature of the second solder joint. A trace may couple the first electrical contact to the second electrical contact. The second electrical contact may be at a different x-position or y-position than the first electrical contact, when the first PCB is viewed from a first surface.