Stepped substrate coating film-forming composition comprising a plasma curable compound by unsaturated bonds between carbon atoms

摘要

[PROBLEMS] To provide a plasma-curable stepped substrate coating film-forming composition for forming a film having fillability and flatness for a pattern. [Solution] Substructure (I) represented by the following formulas (1-1) to (1-7): (In formula, R ¹ , R ^1a , R ³ , R ^5a and R ^6a are respectively independently C1-C10 alkylene group, C6-C40 arylene group (this alkylene group and arylene group are 1 one or may be substituted with more than one amide group, or an amino group), an oxygen atom, a carbonyl group, a sulfur ^{atom, -C (O) -NR a -} , -NR b - , or represents a divalent made of a combination thereof, R ⁵ is each independently a nitrogen atom, a nitrogen atom, an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 40 carbon atoms (the alkylene group and the arylene group include one or two or more amide groups or Optionally substituted with an amino group), an oxygen atom, a carbonyl group, a sulfur atom, ^a trivalent group consisting of a combination with at least one or more groups selected from the group consisting of -C (O) -NR ^a -and -NR ^b- , R ² , R ^2a , R ⁴ , and R ⁶ are each independently a hydrogen atom At least 1 selected from the group consisting of an alkyl group having 1 to 10 carbon atoms or a hydrogen atom, an alkylene group having 1 to 10 carbon atoms, an oxygen atom, a carbonyl group, -C (O) -NR ^a -and -NR ^b-; A monovalent group consisting of a combination of two or more groups, R ^a represents ^a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R ^b represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an alkyl group having 1 to 10 carbon atoms Represents a carbonyl group, n represents a repeating unit number of 1 to 10, and a dotted line represents a chemical bond with adjacent atoms.), A compound (E) and a solvent (F) containing at least one substructure selected from Plasma curable stepped substrate coating film forming composition comprising.