2 SiP SiPMETHOD OF PRODUCING SIP MODULE BASED ON TWO-TIMES PLASTIC-SEALED AND THE SIP MODULE

摘要

The present invention relates to a method of manufacturing an SiP module through secondary molding and an SiP module. The method includes the following steps of: manufacturing a printed circuit board assembly by welding an electronic device necessary for an SiP module with the upper surface of a printed circuit board; enabling a molding compound to cover the electronic device on the upper surface of the printed circuit board by primarily charging the upper surface of the printed circuit board assembly with the molding compound, and then, obtaining a primarily molded printed circuit board assembly after the curing of the molding compound; obtaining a printed circuit board assembly with a film attached thereon by attaching a functional film firmly to the upper surface of the primarily molded printed circuit board; and enabling a molding compound to cover the upper surface and periphery of the printed circuit board assembly with the film attached thereon by secondarily charging the printed circuit board assembly with the film attached thereon with the molding compound, and then, manufacturing an SiP module after the curing of the secondarily charged molding compound. Therefore, the present invention is capable of improving the electromagnetism shield performance of an SiP module.