Methods and apparatus for processing 3D MIM capacitor package

摘要

Methods of treating a substrate include: providing a substrate having a first polymeric dielectric layer; Forming a first RDL on the first polymeric dielectric layer; Configuring the 3D MIM capacitive stack on the first RDL and in at least one opening of the top surface of the second polymer dielectric layer—the 3D MIM capacitive stack is disposed between the top electrode, the bottom electrode, and the top electrode and the bottom electrode. Having an intervening capacitive dielectric layer; Depositing a dielectric layer on the 3D MIM capacitive stack and on the second polymer dielectric layer; And a portion of the dielectric layer to expose at least a portion of the top electrode at the bottom of at least one opening of the 3D MIM capacitive stack and to expose at least a portion of the metal layer at the bottom of the at least one opening of the second polymer dielectric layer. Removing the step.