Composition for tin alloy electroplating containing leveling agent

摘要

The present invention provides a linear or branched polyimide comprising tin ions, additional alloy metal ions selected from silver, copper, indium and bismuth ions, and structural units of formula L1, for depositing a tin or tin alloy containing layer. The use of an aqueous composition comprising at least one additive comprising a dazolium compound, and a method of depositing a tin alloy layer on a substrate: