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Electroplating solution for iron-nickel alloys with low coefficient of thermal expansion and electroplating method using the same
Electroplating solution for iron-nickel alloys with low coefficient of thermal expansion and electroplating method using the same
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机译:低热膨胀系数铁镍合金电镀液及使用该电镀液的方法
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摘要
The following general formula (1) (However, R represents a vinyl group or ethynyl group, X may be substituted, an alkylene group or a phenylene group, and Y represents an alkali metal.) As an electroplating solution for an iron-nickel alloy containing an unsaturated sulfonic acid compound represented by, Further, an electroplating solution for an iron-nickel alloy having a low coefficient of thermal expansion, characterized in that it contains two or more carboxylic acid compounds having one or more carboxyl groups, two or more hydroxy groups, and two or more carbon atoms, and the same. The electroplating method used provides a technique for obtaining an iron-nickel alloy with excellent performance over a wide temperature range by plating.
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