首页> 外国专利> Electroplating solution for iron-nickel alloys with low coefficient of thermal expansion and electroplating method using the same

Electroplating solution for iron-nickel alloys with low coefficient of thermal expansion and electroplating method using the same

机译:低热膨胀系数铁镍合金电镀液及使用该电镀液的方法

摘要

The following general formula (1) (However, R represents a vinyl group or ethynyl group, X may be substituted, an alkylene group or a phenylene group, and Y represents an alkali metal.) As an electroplating solution for an iron-nickel alloy containing an unsaturated sulfonic acid compound represented by, Further, an electroplating solution for an iron-nickel alloy having a low coefficient of thermal expansion, characterized in that it contains two or more carboxylic acid compounds having one or more carboxyl groups, two or more hydroxy groups, and two or more carbon atoms, and the same. The electroplating method used provides a technique for obtaining an iron-nickel alloy with excellent performance over a wide temperature range by plating.
机译:下述通式(1)(但是,R表示乙烯基或乙炔基,X可以被取代,亚烷基或亚苯基,并且Y表示碱金属。)作为铁-镍合金的电镀液此外,具有低热膨胀系数的铁镍合金用​​电镀液,其特征在于,其含有两种以上具有一个以上羧基的羧酸化合物,两个以上羟基的羟基化合物。基团,和两个或多个碳原子相同。所使用的电镀方法提供了一种通过电镀获得在宽温度范围内具有优异性能的铁-镍合金的技术。

著录项

  • 公开/公告号KR20200044860A

    专利类型

  • 公开/公告日2020-04-29

    原文格式PDF

  • 申请/专利权人 가부시끼가이샤 제이씨유;

    申请/专利号KR20207008220

  • 发明设计人 호리 마사오;

    申请日2018-08-03

  • 分类号C25D3/56;

  • 国家 KR

  • 入库时间 2022-08-21 11:07:13

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号