SUBSTRATE PROCESSING APPARATUS INCLUDING LIGHT EMITTING COATING LAYER AND METHOD FOR MANAGING COATING THICKNESS OF COMPONENTS FOR SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus of the present invention includes: a basic material installed in a processing space in which a substrate is processed; and a light emitting coating layer formed on the basic material, wherein the light emitting coating layer includes: a first coating layer having fluorescent properties and emitting light having a second wavelength when light having a first wavelength is incident; and a second coating layer coated on the first coating layer.;COPYRIGHT KIPO 2020