Electroless palladium plating solution and electroless palladium plating film

摘要

An object of the present invention is to provide an electroless palladium plating solution in which a Pd plating film constituting a plating film having excellent wire bonding properties after thermal history is obtained, and the electroless palladium plating solution of the present invention comprises a palladium compound, a hypophosphite compound, and It has the gist to contain at least one member selected from the group consisting of phosphorous acid compounds, at least one member selected from the group consisting of amine borane compounds and hydroboron compounds, and a complexing agent.