Co-Mo Co-Mo Co-Mo COMPOSITE METALIZING METHOD FOR SKUTTERUDITE THERMOELECTRIC MATERIALS Co-Mo COMPOSITE METALIZING STRUCTURE FOR SKUTTERUDITE THERMOELECTRIC MATERIALS STRUCTURE AND MANUFACTURING METHOD FOR SKUTTERUDITE THERMOELECTRIC MATERIALS WITH Co-Mo COMPOSITE METALIZING

摘要

The present invention relates to a metallization method that can improve the efficiency by preventing the diffusion of the skirted ruthetite thermoelectric material, a preparation step of preparing Mo and Co as a powder; A mixing step of mixing the Mo powder and the Co powder; A primary sintering step of primary sintering the mixed powder to form a Co-Mo composite metal film; And a bonding step of bonding the Co-Mo composite metal film to the surface of the skirted tertite thermoelectric material to form a metalizing layer. In the present invention, Mo, which has a disadvantage of high sintering temperature, can be easily metallized in the sclerutite thermoelectric material, and cracks do not occur due to a difference in thermal expansion coefficient at the interface. In addition, compared to the Ti metallization layer previously applied for diffusion prevention, it is possible to easily form a metallization layer having an excellent diffusion prevention effect in a sintering process and a diffusion prevention effect in a practical use environment. Furthermore, compared to the Ti metallization layer applied for preventing diffusion, a metallization layer having a lower contact resistance can be easily formed.