Co-Mo Co-Mo Co-Mo COMPOSITE METALIZING METHOD FOR SKUTTERUDITE THERMOELECTRIC MATERIALS Co-Mo COMPOSITE METALIZING STRUCTURE FOR SKUTTERUDITE THERMOELECTRIC MATERIALS STRUCTURE AND MANUFACTURING METHOD FOR SKUTTERUDITE THERMOELECTRIC MATERIALS WITH Co-Mo COMPOSITE METALIZING

摘要

The present invention relates to a metallization method capable of improving efficiency by preventing diffusion of a scatterudite thermoelectric material, comprising: a preparation step of preparing Mo and Co as powder; A mixing step of mixing Mo powder and Co powder; A first sintering step of first sintering the mixed powder to form a Co-Mo composite metal film; And a bonding step of bonding the Co-Mo composite metal film to the surface of the scatteredite thermoelectric material to form a metalizing layer. In the present invention, Mo, which has a high sintering temperature, can be easily metallized on a scatteredite thermoelectric material, and cracks due to a difference in thermal expansion coefficient are not generated at the interface. In addition, compared to the conventional Ti metalizing layer applied to prevent diffusion, it is possible to easily form a metalizing layer having excellent diffusion preventing effect in the sintering process and diffusion preventing effect in an actual use environment. Furthermore, compared to the conventional Ti metalizing layer applied to prevent diffusion, a metalizing layer having a lower contact resistance can be easily formed.