An improved heat-releasing coating layer a method of forming the heat-releasing coating layer and a heat sink comprising the heat-releasing coating layer

摘要

The present invention relates to a heat dissipation coating layer, and more specifically, improved heat that increases the life of the heat sink and imparts operational stability by greatly improving the heat dissipation performance of the heat dissipation coating layer that lowers the temperature of the heat sink used in the electric and electronic field. It relates to an emission coating layer, a method of forming the heat emission coating layer, and a heat sink including the heat emission coating layer.