Radio frequency heating for rapid curing of nanocomposite adhesives

摘要

A non-contact method of bonding two components through direct heating of a thermosetting adhesive includes applying the thermosetting adhesive to at least a first of the two components. The thermosetting adhesive includes a susceptor that reacts in the presence of an electromagnetic field. The method includes placing the first and second of the two components in proximity to the electromagnetic field. In some aspects, the method includes placing the first and second components in proximity to an electromagnetic field of a capacitor. The susceptor interacts with the electromagnetic field to heat the thermosetting adhesive through resistance heating. In some aspects, the method for direct contact heating of the thermosetting adhesive includes attaching electrodes to a film comprising the adhesive. The components bonded together are not directly heated by the electromagnetic field and consequently have a much lower temperature than the thermosetting adhesive.