CUT WORKING METHOD OF WORKPICE AND CUT WORKING APPARATUS OF WORKPIECE

摘要

[Problem] Provides a method for cutting a workpiece that can realize cutting with less deterioration of the warp value with an X-θ-type wire small device even when the direction in which the warp value is greatly deteriorated (the θ direction) is the cutting direction. do. [Solution means] A plurality of wire guides arranged at predetermined intervals so that the rotation axis directions of each other are parallel to each other, and each having a groove at a predetermined pitch on the outer surface, and spirally wound at a predetermined pitch in the groove of the wire guide As a plurality of workpieces for forming and cutting a wire row by wires, by installing n (n≥2) ingots in parallel and rotating the wire guide, the wires are driven in the axial direction while the plurality of workpieces are cut. A method for cutting a work in which the work is simultaneously press-contacted to the wire row, and the plurality of work is simultaneously cut into a wafer form at a plurality of locations, wherein the work has a central axis direction of 111 or 100 Along with being a single crystal ingot having a direction, at least one of the plurality of workpieces becomes a single crystal ingot having a 111 direction in the central axis direction, and a single crystal ingot having a 111 direction in the central axis direction is cut with a wire. When the angle of deviation from the 110 direction at the time of cutting is set to θ (°) (however, the deviation from the (1-10) direction, (-101) direction, and (01-1) direction The angle θ is the counterclockwise rotation direction in both directions, the deviation angle θ from the (0-11) direction, the (-110) direction, and the (10-1) direction is the clockwise rotation direction in both directions,- 30°≦θ≦+30° In addition, θ of a single crystal ingot whose central axis direction has a 100 direction is 0° regardless of the cutting direction), and θ of each of the plurality of workpieces Cutting is performed by setting the cutting direction of each ingot so that the total (θ ₁ +θ ₂ +···+θ _n ) becomes -30°≤θ ₁ +θ ₂ +···+θ _n ≤30°. Cutting process method.