首页> 外国专利> Ion depth profile controlling method ion implant method and semiconductor device manufacturing method based on the controlling method and ion implant system adapting the controlling method

Ion depth profile controlling method ion implant method and semiconductor device manufacturing method based on the controlling method and ion implant system adapting the controlling method

机译:离子深度分布控制方法,基于该控制方法的离子注入方法和半导体器件制造方法以及与该控制方法相适应的离子注入系统

摘要

The technical idea of the present invention is a method for controlling an ion depth profile so that the ion depth profile becomes a box profile through a single process, an ion implant method based on the control method, a semiconductor device manufacturing method, and a control method thereof. Provides an ion implant system. The control method is a reinforcement that receives the similarity between the ion depth profile, which is the ion concentration according to the depth of the wafer in the ion implant process, and the box profile, which is the target profile, as a reward. Performing reinforcement learning; Acquiring at least one process condition of the ion implant process as a result of the reinforcement learning; And generating a process recipe for the at least one process condition.
机译:本发明的技术思想是用于控制离子深度轮廓以使得离子深度轮廓通过单个过程变为箱形轮廓的方法,基于该控制方法的离子注入方法,半导体器件制造方法以及控制方法。方法。提供离子注入系统。该控制方法是一种加强件,该加强件接收作为在离子注入过程中根据晶片的深度的离子浓度的离子深度曲线和作为目标曲线的盒形曲线之间的相似性作为奖励。进行强化学习;作为强化学习的结果,获取离子注入工艺的至少一种工艺条件;并为至少一个工艺条件生成工艺配方。

著录项

  • 公开/公告号KR20200112586A

    专利类型

  • 公开/公告日2020-10-05

    原文格式PDF

  • 申请/专利权人 삼성전자주식회사;

    申请/专利号KR20190075785

  • 发明设计人 정성락;강승모;

    申请日2019-06-25

  • 分类号H01J37/317;

  • 国家 KR

  • 入库时间 2022-08-21 11:05:56

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