首页> 外国专利> STRUCTURE FOR SPRAYING NITROGEN GAS TO WAFER FOR EFEM AND EFEM HAVING STRUCTURE FOR SPRAYING NITROGEN GAS TO WAFER FOR EFEM

STRUCTURE FOR SPRAYING NITROGEN GAS TO WAFER FOR EFEM AND EFEM HAVING STRUCTURE FOR SPRAYING NITROGEN GAS TO WAFER FOR EFEM

机译:EFEM喷射氮气的结构以及EFEM EFEM喷射氮气的结构

摘要

A disclosed structure of spraying nitrogen gas to a wafer for an EFEM includes an EFEM back wall and a nitrogen gas spraying unit, thereby enabling the nitrogen gas sprayed from the nitrogen gas spraying unit to be intensively sprayed toward the wafer discharged to the front of a load lock chamber unit and enabling the wafer discharged to the front of the load lock chamber unit to be purged and cooled by the nitrogen gas. Therefore, a phenomenon such that remaining gas on the wafer reacts in the EFEM so that by-products are formed is prevented.;COPYRIGHT KIPO 2020
机译:所公开的向EFEM晶片喷射氮气的结构包括EFEM后壁和氮气喷射单元,从而使得从氮气喷射单元喷射的氮气能够朝着排放到晶片前部的晶片集中喷射。装载锁定腔室单元,使排出到装载锁定腔室单元前部的晶片被氮气吹扫并冷却。因此,可以防止晶片上残留的气体在EFEM中反应从而形成副产物的现象。; COPYRIGHT KIPO 2020

著录项

  • 公开/公告号KR102080016B1

    专利类型

  • 公开/公告日2020-02-21

    原文格式PDF

  • 申请/专利权人 AK TECH CO. LTD.;

    申请/专利号KR1020180110750

  • 发明设计人 JOO YOUNG BYEONG;KIM YONG JU;

    申请日2018-09-17

  • 分类号H01L21/67;H01L21/673;H01L21/677;

  • 国家 KR

  • 入库时间 2022-08-21 11:05:16

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