FRONT SIDE PACKAGE-LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQUE IDENTIFIERS

摘要

A method of manufacturing a semiconductor device can include providing a plurality of semiconductor dies, each semiconductor die comprising an active surface and a back surface opposite the active surface. The method includes forming a build-up interconnect structure that extends over the active surface of each of the plurality of semiconductor dies in the wafer, and while forming a unique identification mark for each of the plurality of semiconductor dies as part of a layer in the build-up interconnect structure. And simultaneously forming a layer of the build-up interconnect structure. The layers of the build-up interconnect structure can include both unique identification marks for each of the plurality of semiconductor dies and functionality for the semiconductor device. Each unique identification mark can convey the unique identity of its respective semiconductor die. The method may further include singulating the plurality of semiconductor dies into the plurality of semiconductor devices.