首页> 外国专利> MICROSTRUCTURED CHIP COMPRISING CONVEX SURFACES FOR SURFACE PLASMON RESONANCE ANALYSIS ANALYSIS DEVICE CONTAINING SAID MICROSTRUCTURED CHIP AND USE OF SAID DEVICE

MICROSTRUCTURED CHIP COMPRISING CONVEX SURFACES FOR SURFACE PLASMON RESONANCE ANALYSIS ANALYSIS DEVICE CONTAINING SAID MICROSTRUCTURED CHIP AND USE OF SAID DEVICE

机译:包含凸面的微结构芯片,用于表面等离子共振分析分析设备,包括所述微结构芯片和所述设备的使用

摘要

The present invention is a cube formed by a base surface (5; 77), a top surface (4; 44) at least partially covered with a metal layer (2; 22; 42; 52; 62), and at least one side (55; 66). Microstructured chips (3; 33; 43; 53; 63) for surface plasmon resonance (SPR) analysis, taking the form of The chip has micrometer-sized zones whose top surface is selected from n protrusions and m cavities and intended to accommodate the species to be analyzed; When n + m ≥ 2 (n is 1 to j, m is 0 to i, j and i are integers), the zones are characterized by being separated from each other by flat surfaces.
机译:本发明是由底表面(5; 77),至少部分地覆盖有金属层(2; 22; 42; 52; 62)的顶表面(4; 44)和至少一侧形成的立方体。 (55; 66)。用于表面等离振子共振(SPR)分析的微结构芯片(3; 33; 43; 53; 63),形式为芯片具有微米级尺寸的区域,其上表面选自n个突起和m个空腔,旨在容纳物种被分析;当n + m≥2(n为1到j,m为0到i,j和i为整数)时,区域的特征是被平面彼此隔开。

著录项

  • 公开/公告号KR102103610B1

    专利类型

  • 公开/公告日2020-05-29

    原文格式PDF

  • 申请/专利权人 머시 티보;

    申请/专利号KR20147013729

  • 发明设计人 머시 티보;

    申请日2012-10-25

  • 分类号G01N21/55;C12Q1/68;G01N21/64;G01N33/543;

  • 国家 KR

  • 入库时间 2022-08-21 11:04:52

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