首页> 外国专利> A manufacturing apparatus for manufacturing a fluorine resin packing used in semiconductor manufacturing a manufacturing method of a fluorine resin packing for semiconductor manufacturing using the manufacturing apparatus and a fluorine resin packing for semiconductor manufacturing using the manufacturing method

A manufacturing apparatus for manufacturing a fluorine resin packing used in semiconductor manufacturing a manufacturing method of a fluorine resin packing for semiconductor manufacturing using the manufacturing apparatus and a fluorine resin packing for semiconductor manufacturing using the manufacturing method

机译:用于制造在半导体制造中使用的氟树脂填充物的制造设备,使用该制造设备的用于半导体制造的氟树脂填充物的制造方法以及使用该制造方法的用于半导体制造的氟树脂填充物。

摘要

The present invention is a plurality of packing support portion for supporting the inner peripheral surface of the fluorine resin packing member having a hollow; A holder provided in the center of the plurality of packing supports; A connecting portion connecting the plurality of packing supports to the holder; It relates to an apparatus for manufacturing a fluorine resin packing member for semiconductor manufacturing, characterized in that it comprises; a pressing part for pressing the plurality of packing support so that the plurality of packing support parts are spaced apart from the holder and in close contact with the inner circumferential surface of the fluorine resin packing member. .
机译:本发明是用于支撑具有中空的氟树脂包装部件的内周面的多个包装支撑部。在多个包装支架的中央设置有支架。连接部分,其将多个包装支撑件连接至保持器;本发明涉及一种用于半导体制造的氟树脂包装构件的制造装置,其特征在于,包括:按压部,其对多个包装支撑部进行按压,以使多个包装支撑部与保持架间隔开并与氟树脂包装部件的内周面紧密接触。 。

著录项

  • 公开/公告号KR102104247B1

    专利类型

  • 公开/公告日2020-04-24

    原文格式PDF

  • 申请/专利权人 (주)동인;

    申请/专利号KR20180121447

  • 发明设计人 이태우;

    申请日2018-10-12

  • 分类号B29C71/02;F16L17;H01L21/67;B29L31/26;

  • 国家 KR

  • 入库时间 2022-08-21 11:04:50

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