THERMOPLASTIC COMPOSITIONS HAVING GOOD DIELECTRIC AND DUCTILITY PROPERTIES

摘要

The present invention comprises 29.9 wt% to 84.9 wt% of a base resin comprising poly(p-phenylene oxide) (PPO), polystyrene (PS) and impact modifier; 15 wt% to 70 wt% dielectric filler; And from 0.1 wt% to 10 wt% of a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of 3.0 to 8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles comprising thermoplastic compositions, and in particular telecommunication devices, are also described.