Embodiments of the present disclosure describe multi-device flexible systems on a chip (SOCs) and methods of manufacturing such SOCs. The multi-material stack can be sequentially processed to form multiple integrated circuit (IC) devices in a single flexible SOC. By forming IC devices from a single stack, it is possible to form contacts for multiple devices through a single metallization process, and it is possible for those contacts to be located in the common back-plane of the SOC. The stack layers can be aligned and processed according to the processing temperature so that higher temperature processes are performed first. In this way, the intervening layers of the stack can shield certain stack layers from the elevated processing temperature associated with the processing of the upper layers of the stack. Other embodiments may also be described and/or claimed.
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