首页> 外国专利> Photo mask structures for manufacturing multi-layered micro-pattern body and multi-layered micro-pattern body manufacturing method using the same

Photo mask structures for manufacturing multi-layered micro-pattern body and multi-layered micro-pattern body manufacturing method using the same

机译:用于制造多层微图案主体的光掩模结构以及使用该掩模结构的多层微图案主体的制造方法

摘要

A photo mask structure for manufacturing a multi-fine pattern body and a method of manufacturing a multi-fine pattern body using the same are disclosed. The photomask structure for manufacturing a multi-fine pattern body according to the present invention is a transparent and flexible flexible substrate capable of transmitting light, and a partial light shielding formed on the upper surface of the flexible substrate by blocking light. It characterized in that it comprises a first pattern layer for the first pattern layer, and a second pattern layer that is a physical irregularity having a predetermined height formed on the upper surface of the first pattern layer. In the photomask structure for manufacturing a multi-fine pattern body according to the present invention, a partial light-shielding layer and a physical uneven layer are formed on a flexible substrate, so that roll-coating lamination is possible in a subsequent process, and multiple layers can be laminated with only one exposure and development. Since it is possible to manufacture a fine pattern body having a pattern of, it can greatly contribute to quality stabilization and cost reduction, reducing manufacturing man-hours.
机译:公开了一种用于制造多层图案体的光掩模结构以及使用该掩模结构的多层图案体的制造方法。根据本发明的用于制造多细图案体的光掩模结构是能够透射光的透明且柔性的柔性基板,并且是通过阻挡光而形成在柔性基板的上表面上的部分遮光物。其特征在于,其包括用于第一图案层的第一图案层和形成在第一图案层的上表面上的具有预定高度的物理不规则的第二图案层。在根据本发明的用于制造多精细图案体的光掩模结构中,在柔性基板上形成部分遮光层和物理不平坦层,从而可以在后续工艺中进行辊涂层压,并且仅需一次曝光和显影,即可层压多层。由于可以制造具有图案的精细图案主体,因此可以极大地有助于质量稳定和成本降低,减少了制造工时。

著录项

  • 公开/公告号KR102164142B1

    专利类型

  • 公开/公告日2020-10-12

    原文格式PDF

  • 申请/专利权人 주식회사 우리옵토;김종엽;

    申请/专利号KR20200056054

  • 发明设计人 김종엽;

    申请日2020-05-11

  • 分类号G03F7;G03F1/46;

  • 国家 KR

  • 入库时间 2022-08-21 11:03:36

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