首页> 外国专利> MANUFACTURING METHOD OF MICRONEEDLE PATCH MICRONEEDLE PATCH MANUFACTUED BY THE METHOD AND MATERIAL DELIVERY SYSTEM COMPRISING THE MICRONEEDLE PATCH

MANUFACTURING METHOD OF MICRONEEDLE PATCH MICRONEEDLE PATCH MANUFACTUED BY THE METHOD AND MATERIAL DELIVERY SYSTEM COMPRISING THE MICRONEEDLE PATCH

机译:微线贴片的制造方法微线贴片的制造方法及包括微线贴片的材料输送系统

摘要

The present invention relates to a method of manufacturing a microneedle patch, a microneedle manufactured thereby, and a mass transfer system including the same, wherein the method of manufacturing a microneedle patch according to an embodiment of the present invention comprises: manufacturing a mother mold; Filling and curing the mother mold and then separating the cured polymer to prepare a first polymer array mold; Plating the first polymer array mold to manufacture a mold; Manufacturing a mold mother mold by removing the first polymer array mold from the mold mold; Filling and curing a polymer in the mold mother mold and separating the cured polymer to prepare a second polymer array mold; Manufacturing a microneedle patch array by double casting the second polymer array mold; And separating a microneedle patch including a microneedle structure from the microneedle patch array after injection-molding a patch material on the microneedle patch array.
机译:本发明涉及一种微针贴片的制造方法,由其制造的微针以及包括该微针贴片的传质系统,其中,根据本发明实施方式的微针贴片的制造方法包括:制造母模;填充并固化母模,然后分离固化的聚合物以制备第一聚合物阵列模。电镀第一聚合物阵列模具以制造模具;通过从模具中移除第一聚合物阵列模具来制造模具母模;在模具母模中填充和固化聚合物,并分离固化的聚合物以制备第二聚合物阵列模具;通过双浇铸第二聚合物阵列模具来制造微针贴片阵列;在将注射剂材料注射成型在微针贴片阵列上之后,将包括微针结构的微针贴片与微针贴片阵列分离。

著录项

  • 公开/公告号KR102164792B1

    专利类型

  • 公开/公告日2020-10-14

    原文格式PDF

  • 申请/专利权人 한국기초과학지원연구원;

    申请/专利号KR20180168331

  • 发明设计人 남기환;제순규;김동욱;

    申请日2018-12-24

  • 分类号B29C45/14;A61K47/30;A61K9;A61K9/70;A61M37;B29C33/40;B29C33/42;B29C33/56;B29C39/02;H01J37/305;B29L31;

  • 国家 KR

  • 入库时间 2022-08-21 11:03:35

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