首页> 外国专利> the antimicrobial adhesive film using the dispersion solution in which the copper nanoparticle and copper micro particle are mixed to the specific gravity difference and a method of manufacture thereof

the antimicrobial adhesive film using the dispersion solution in which the copper nanoparticle and copper micro particle are mixed to the specific gravity difference and a method of manufacture thereof

机译:使用其中将铜纳米颗粒和铜微粒混合至比重差的分散溶液的抗微生物粘合剂膜及其制造方法

摘要

The present invention uses the difference in specific gravity between the copper particles having antibacterial function and the dispersion solvent so that the copper particles are uniformly and evenly dispersed in the dispersion solvent, so that the copper nanoparticles and the copper microparticles form a coating layer on the base film. It relates to an antibacterial adhesive film using a mixed dispersion solution and a method of manufacturing the same. The manufacturing method of the antibacterial adhesive film is 0.03 to 0.5㎛ copper nanoparticles 80 to 99% by weight and 1 to 30㎛ copper microparticles 1 to 20% by weight of the mixed antibacterial copper particles by a dispersion solvent, the 0.03 to 0.5㎛ Due to the buoyancy according to the difference in specific gravity of 80 to 99% by weight of copper nanoparticles, the 1 to 30 μm copper microparticles having a relatively large particle size of 1 to 20% by weight are induced to be evenly dispersed, and 30 to 70% by weight of the copper particles and the above Maintaining a copper particle colloidal solution in which the nanocopper particles and copper microparticles are evenly dispersed in the dispersion solvent by mixing 30 to 70% by weight of a dispersion solvent; In order to prevent precipitation of the copper particles and to rapidly cure the copper particle colloidal solution, 10 to 70% by weight of a thermosetting binder and 0.5 to 10% by weight of a curing agent are mixed with 20 to 89.5% by weight of the copper particle colloidal solution, or , In order to improve moldability and prevent cracking, mixing 10 to 70% by weight of a urethane acrylate-based oligomer, which is a UV curing binder, to 30 to 90% by weight of the copper particle colloidal solution to prepare a copper particle dispersion coating; Forming a contact-type copper particle dispersion coating layer of 3 to 500 μm on one side of the base film by applying the copper particle dispersion coating to a base film in a comma roll, a slow die, a micro roll, a roll to roll, and a screen method; On the other side of the base film, a pressure-sensitive adhesive containing at least one of acrylic (ACRYL)-based, silicone (SILICONE)-based, EVA-based, and polyurethane-based adhesives is used as comma roll, slow die, micro roll, roll to roll, It includes the step of forming a pressure-sensitive adhesive layer forming adhesiveness to the object by applying in a screen method.
机译:本发明利用具有抗菌功能的铜颗粒与分散溶剂之间的比重差,从而使铜颗粒均匀且均匀地分散在分散溶剂中,从而铜纳米颗粒和铜微粒在其上形成涂层。基膜。本发明涉及使用混合分散液的抗菌粘合膜及其制造方法。抗菌粘合膜的制造方法是:使用分散溶剂,将混合抗菌铜粒子的0.03〜0.5㎛,80〜99重量%,混合抗菌铜粒子的1〜30㎛,1〜20重量%,0.03〜0.5㎛,0.03〜0.5㎛,由于根据80-99重量%的铜纳米粒子的比重差而产生的浮力,导致具有1-20重量%的较大粒径的1-30μm的铜微粒被均匀分散,并且30〜70重量%的铜粒子以上,通过混合30〜70重量%的分散溶剂,维持纳米铜粒子和铜微粒均匀分散在分散溶剂中的铜粒子胶体溶液。为了防止铜颗粒沉淀并快速固化铜颗粒胶体溶液,将10至70重量%的热固性粘合剂和0.5至10重量%的固化剂与20至89.5重量%的铜混合。铜粒子胶体溶液,或,为了提高成型性并防止开裂,将10至70重量%的作为紫外线固化粘合剂的聚氨酯丙烯酸酯基低聚物与30至90重量%的铜粒子混合胶体溶液以制备铜颗粒分散涂层;通过在逗号辊,慢速模头,微辊,辊对辊中将铜颗粒分散体涂层施加到基膜上,在基膜的一侧上形成3至500μm的接触型铜颗粒分散体涂层。 ,以及屏幕方法;在基膜的另一侧,将包含丙烯酸(ACRYL)基,硅酮(SILICONE)基,EVA基和聚氨酯基粘合剂中的至少一种的压敏粘合剂用作逗号辊,慢模。包括微辊,辊对辊(roll to roll),其包括通过以丝网法施加而形成对对象具有粘合性的压敏粘合剂层的步骤。

著录项

  • 公开/公告号KR102170441B1

    专利类型

  • 公开/公告日2020-10-28

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR1020200049768

  • 发明设计人 차민호;

    申请日2020-04-24

  • 分类号C09J7/20;C09D5/02;C09D5/14;C09J7/22;C09J7/30;C09J7/40;

  • 国家 KR

  • 入库时间 2022-08-21 11:03:26

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