A coolable substrate with at least one microelectronic component and / or as a carrier for microelectronic units and use of at least one laser for structuring at least a region of a surface of a substrate

摘要

The invention relates to boilable substrates with at least one microelectronic component and / or as a carrier for microelectronic units and uses at least one laser for structuring at least one area of a surface of a substrate the surface with the microelectronic component and / or the surface of the substrate opposite the microelectronic units is a surface roughened and / or structured and / or regularly textured and / or relief-like by means of laser radiation from at least one laser.