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Method and device for the preparation of a fine machining tool and a fine machining tool

机译:用于制备精细加工工具的方法和装置以及精细加工工具

摘要

In a method for reprocessing a fine machining tool designed as a honing tool or finishing tool, which is designed for machining workpiece surfaces by means of geometrically indeterminate cutting edges, the fine machining tool has at least one cutting means carrier (552) which carries at least one cutting coating (565) which within a bond ( 556) has bonded cutting grains (557) and an abrasive working surface (551) for engagement with the workpiece surface. The method comprises the creation of the macro shape of the abrasive working surface (551) of the cutting coating (565) and a setting back of the bond (556) relative to the cutting grains (557) to produce a grain protrusion (K) on the working surface of the cutting coating. The method is characterized in that the setting back of the bond (556) with respect to the cutting grains (557) is carried out by means of selective laser ablation by irradiating the working surface (551) with pulsed laser radiation (LS) which is suitable for the material of the bond (556 ) between cutting grains (557) without removing the cutting grains to the same extent at the same time.
机译:在一种用于加工设计为珩磨工具或精加工工具的精加工工具的方法中,该精加工工具被设计用于借助于几何形状不确定的切削刃来加工工件表面,该精加工工具具有至少一个切割装置载体(552),该切割装置载体(552)承载至少一个切削涂层(565),该切削涂层在结合剂(556)内具有结合的切削颗粒(557)和用于与工件表面接合的研磨工作表面(551)。该方法包括形成切削涂层(565)的磨料工作表面(551)的宏观形状和相对于切削晶粒(557)的粘结(556)的缩进以产生晶粒突起(K)在切削涂层的工作表面上。该方法的特征在于,结合剂(556)相对于切割晶粒(557)的后退是通过选择性的激光烧蚀来进行的,该选择性的激光烧蚀是通过向工作表面(551)照射脉冲激光辐射(LS)而实现的。适用于切削颗粒(557)之间的粘结(556)的材料,而不同时去除切削颗粒到相同程度。

著录项

  • 公开/公告号DE102019202533A1

    专利类型

  • 公开/公告日2020-08-27

    原文格式PDF

  • 申请/专利权人 ELGAN-DIAMANTWERKZEUGE GMBH & CO. KG;

    申请/专利号DE102019202533A1

  • 发明设计人 THOMAS WITT;

    申请日2019-02-25

  • 分类号B23K26/36;B23K26/352;B23K26/08;B24B33/08;B24B53;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:17

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