Projection exposure system for semiconductor lithography with improved heat management

摘要

The invention relates to a projection exposure system (1) for semiconductor lithography comprising - a cooling arrangement (35) for a plurality of individual components (23), comprising - a number of n inlet segments (33.1-33.9) for supplying n cooling channels (26) with a cooling medium (32), at least one inlet segment (33.1-33.9) being assigned to each cooling channel (26), - a number of n outlet segments (34.1 -34.9) for removing the cooling medium (32) from the cooling channels (26), one each Cooling channel (26) is assigned to at least one outlet segment (34.1 -34.9), - a plurality of inlet or outlet segments (33.1-33.9), (34.1 -34.9) being in direct hydraulic connection with one another, with the geometric configurations differing at least two Inlet or outlet segments (33.1-33.9), (34.1 -34.9) in such a way that despite different mass flows of cooling medium (32) through the inlet or outlet segments (33.1-33.9), (34.1 -34.9) the mass flow through the associated cooling channels (26) is comparatively large.