LOW COST MANUFACTURING PROCESS OF A MODULAR POWER SWITCHING ELEMENT

摘要

METHOD OF LOW COST MANUFACTURING OF A MODULAR POWER SWITCHING ELEMENT The method of the invention The method is designed for the manufacture of a modular power switching element (MP) comprising first and second laminated blocks (BL, BH ) between which is clamped at least one transistor chip (CP1, CP2). The first and second laminated blocks respectively comprise first and second bus-bars (BBL, BBH) on which internal dielectric and conductive layers are laminated. The method comprises, prior to the lamination of the first and second laminate blocks, the parallel manufacture of a first blank of the first laminate block (BL) and of a second blank of the second laminate block (BH), this manufacture in parallel comprising at least one punching and / or die-forging operation making at least one orifice (OR1, OR2) in the first bus-bar and / or the second bus-bar, production of a dielectric layer (DL1 , DL2) covering the interior of the orifice and a metallization (CU2, CU3) of the interior of the orifice including the dielectric layer. Fig. 2