Method and device for manufacturing preforms intended for soldering electronic, photonic, thermal or mechanical components.

摘要

The invention relates to a process for the pretreatment of a brazing composition comprising metal particles having a particle size of the order of a micrometer or a nanometer, one or more binders and one or more solvents, said process comprising: a desolvation step of the brazing composition (8), so as to obtain a desolvated brazing composition (11), - then a step of compacting the desolvated brazing composition (11) so as to obtain a preform (3) of metal particles, said preform being suitable for use for sintering an electronic, photonic, thermal or mechanical component on a substrate, the brazing composition (11) being represented either by a solder paste, or by a suspension of metal grains or of metal oxalate suspended in a solvent. The invention also relates to a device for implementing the method. Figure 1