Circuit assembly 200 comprises a substrate 210 and conducting layers 250 on opposing sides of the substrate 210. At least one via 220 passes through the substrate 210, wherein the via 220 forms a conductive path between the conducting layers 250. The substrate 210 is a foam substrate and the via 220 is provided with a solid dielectric lining 270 plated with a conducting material. Also disclosed is a method of manufacturing the same, said method comprises machining to define a hole through the substrate 210 and providing a solid dielectric lining 270 around the hole, wherein the lining 270 covers the substrate 210 in the region of the hole so as to provide a via 220 having a surface suitable for metal plating (mass manufacture). Said method also comprises metal plating the via to form the conducting via 220. The substrate 210 may be a Rohacell (RTM) foam structure.
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