Semiconductor structures

摘要

A semiconductor wafer 80’ is provided which may be diced into a plurality of primary die 800. A primary die 800 comprises at least one aperture 801 extending through the primary die 800 from an upper surface of the primary die 800 to a lower surface of the primary die 800, wherein each aperture 801 is suitable for receiving a secondary die 850. The wafer 80’ may be provided on a carrier layer 830 which serves to support the wafer 80’ in the region of the opening 801 whilst a secondary die 850 is positioned within the aperture 801. The secondary die 850 may be secured within the hole 801 using moulding material. A micro-electro-mechanical (MEMS) transducer 802 may be provided on the primary die 800, the microelectromechanical transducer 802 being a microphone. The secondary die 850 may comprise a transducer die or a circuitry die.